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This book provides a low-temperature deposition method of ceramic-based high-k functional thick/thin films employing room-temperature aerosol deposition (AD) process. It's possible to deposit high density and quality ceramic films from initial nano-particles without any high-temperature process on almost any kinds of substrate. The AD process takes an advantage of the room-temperature deposition phenomenon for the embedded capacitor technology that is based on three-dimensional integration of passive components with the low-melting point materials such as metals and plastics. Consequently, in order to realize the embedded capacitor technologies using the AD process, several investigations for high capacitance density, dielectric strength, and tolerance were introduced in this book.