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This book contains extended and revised versions of the best papers that were presented during the fouteenth IFIP TC 10/WG 10.5 International Conference on Very arge Scale Integration. The purpose of this conference, sponsored by IFIP TC 10 WG 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels.§For more information about the 300 other books in the IFIP series, please visit www.springer.com.§For more information about IFIP, please visit www.ifip.org.